Tata Electronics and Besi Enter Strategic Partnership to Strengthen Advanced Packaging Capabilities

• Besi’s advanced packaging portfolio will help accelerate technology readiness at Tata Electronics’ semiconductor packaging facility in Jagiroad, Assam 
• Collaboration in line with the nation’s goal of building a self-sufficient and globally competitive OSAT industry for our customers worldwide 

New Delhi, 17 September 2026: Tata Electronics, a pioneering leader in India’s electronics and semiconductor manufacturing sector, and Besi, a leading Dutch provider of semiconductor assembly solutions, have signed a Memorandum of Understanding (MoU) to strengthen advanced packaging capabilities in India. Tata Electronics is investing $3 Bn for India’s first indigenous semiconductor packaging facility in Jagiroad, Assam. As part of the collaboration, Tata Electronics will leverage Besi’s extensive portfolio of advanced packaging equipment and technologies.  

The partnership aligns closely with the next phase of India’s semiconductor program, which seeks to establish a self-sufficient and globally competitive domestic OSAT industry. The partnership also reflects the growing momentum in India-Netherlands semiconductor cooperation following the Memorandum of Understanding on Partnership on Semiconductors and Related Emerging Technologies signed by the two countries. 

The partnership will assess opportunities to strengthen the local semiconductor equipment support ecosystem, facilitate technical collaboration, and enhance long-term equipment readiness for Tata Electronics' semiconductor packaging operations. Leveraging Besi’s extensive portfolio of advanced packaging solutions and global expertise, the collaboration will support the technology readiness of Tata Electronics’ semiconductor packaging facility in Jagiroad, Assam, while advancing its journey toward next-generation packaging capabilities.  

Through this partnership, Besi will also evaluate initiatives to support engineering capability development, knowledge-sharing programs and specialized training and certification of Tata Electronics employees, to improve operational flexibility and efficiency. Both companies will work together to develop a shared technology roadmap and innovative processes to enable mutual, long-term growth and build a resilient and globally competitive supply chain in India. 

Dr. Randhir Thakur, CEO & MD, Tata Electronics, said, “Advanced packaging is rapidly becoming one of the most critical differentiators in semiconductor innovation. We are delighted to partner with Besi, a global leader in advanced packaging equipment. By combining Besi's world-class expertise with Tata Electronics' growing manufacturing platform, we aim to accelerate the development of advanced packaging capabilities in India, foster innovation, and help establish a robust semiconductor ecosystem that serves both domestic and global customers.” 

Mr. Richard Blickman, CEO & Chairman, Besi, said, “For over three decades, Besi has strived to create long-term value for stakeholders. Through this collaboration, our diverse range of advanced packaging solutions will support Tata Electronics' vision of becoming a global leader in semiconductor manufacturing. The partnership also reflects our shared commitment to innovation, technology development and the advancement of the semiconductor industry.” 

About Tata Electronics Private Limited 

Tata Electronics Private Limited is a prominent global player in the electronics manufacturing industry, with strong capabilities in Electronics Manufacturing Services, Semiconductor Assembly & Test, Semiconductor Foundry, and Design Services. Established in 2020 as a greenfield venture of the Tata Group, the company aims to serve global customers through integrated offerings across a trusted electronics and semiconductor value chain. With a rapidly growing workforce, the company has significant operations in India in Gujarat, Assam, Tamil Nadu, and Karnataka, in addition to overseas offices in US, Taiwan, and Singapore. Tata Electronics is committed to creating a socio-economic footprint by employing many women in its workforce and actively supporting local communities through environmental, education, healthcare, sports and livelihood initiatives.  

For more information visit www.tataelectronics.com. 

About Besi 

BE Semiconductor Industries N.V. (Besi) is a leading global supplier of advanced semiconductor assembly and packaging equipment, serving semiconductor manufacturers and electronics companies worldwide. The company specializes in next-generation packaging technologies that enable high-performance computing, artificial intelligence (AI), data center, automotive, and consumer electronics applications. Besi's portfolio includes die attach, flip-chip bonding, thermo-compression bonding (TCB), hybrid bonding, molding, and other advanced assembly solutions that are critical for the production of cutting-edge semiconductor devices. As the industry transitions toward increasingly complex 2.5D, 3D, and chiplet-based architectures, Besi continues to play a pivotal role in enabling advanced packaging innovations that improve performance, power efficiency, and scalability. With a strong focus on wafer-level and substrate-level assembly technologies, Besi is widely recognized for delivering high levels of precision, reliability, and productivity to leading semiconductor manufacturers across the globe. 

For more information, please visit our website at www.besi.com.